RADSYS will exhibit in INTERPACK 2020 in Düsseldorf Messe

From May 7th till May 13th, RADSYS will be exhibiting at the INTERPACK 2020 fair in Düsseldorf Messe.

INTERPACK is an International Packaging fair for the sectors food, beverages, confectionery, bakery, pharmaceutics, cosmetics, non food and industry.

Come and see us at the AWEX (Wallonia Export & Investment) booth in Hall 10 - B22

Our partner PCT EBI (www.pctebi.com) will also be present to showcase Electron Beam solutions for Packaging.

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