From Feb 25th till Mar 3rd 2021, RADSYS will be exhibiting at the INTERPACK fair in Düsseldorf Messe.
INTERPACK is an International Packaging fair for the sectors food, beverages, confectionery, bakery, pharmaceutics, cosmetics, non food and industry.
Come and see us at the AWEX (Wallonia Export & Investment) booth in Hall 10 - B22
Our partner PCT EBI (www.pctebi.com) will also be present to showcase Electron Beam solutions for Packaging.
